Board inspection PCB, BGA, AOI/AXI, ball-wedge and wire bonding machines: our software recognizes defects with an accuracy better than 1 µm.
Completeness: Insufficient soldering paste, missing diodes, rotated components: SEETECH’S SOFTWARE detects all incomplete or incorrectly positioned parts within milliseconds.
Positioning: Board alignment, fiducial localization: SEETECH’S SOFTWARE reliably finds objects with an accuracy better than 1/20 pixel also if they are partially occluded.
Surface inspection: Different materials, different error classes like holes, wrinkles, edge cracks, inclusions, contaminants, coating voids, scratches, spots, and dents: SEETECH’S SOFTWARE’s advanced filtering techniques are tailored to your needs.
Print inspection: Labels, stamps and forms printed on paper, plastic, or metal by any kind of printer: SEETECH’S SOFTWARE automatically compares trained patterns with your prints. Moreover, SEETECH’S SOFTWARE provides data code print quality inspection according to ISO/IEC 15415.
Identification: Identify and read bar codes, 2D data codes and perform OCR: SEETECH’S SOFTWARE reads a single character in < 0.1 ms.
Automotive & Robotics
Determine the 3D pose of objects based on a CAD model, extract 3D data for bin picking and robot path planning: SEETECH’S SOFTWARE’s unique 3D techniques open new possibilities for numerous automotive and robotics applications.
Surveillance & Security
Whether you need offline processing of digitally recorded videos or online processing of images from a dome camera: SEETECH’S SOFTWARE provides outstanding methods for segmenting video streams.
Shape-based Matching
SEETECH’S SOFTWARE’s superior subpixel-accurate matching technology finds objects robustly and accurately in real-time, even if they are rotated, scaled, partially occluded or located outside of the image, or undergo non-linear illumination changes. It can process images with 8 or 16 bits and handles also color or multi-channel images. Objects can be trained from images or from CAD-like data.
Component-based Matching
SEETECH’S SOFTWARE’s unique component-based matching is able to locate objects that are composed of multiple parts that can move with respect to each other.
Blob Analysis
Hysteresis, local, binary, and standard thresholding, plus more than 20 additional segmentation operators; area, orientation, and 50 more shape and gray value features: SEETECH’S SOFTWARE performs blob analysis within milliseconds.